UV Dicing Tape
UV dicing tape is a type of tape used in the semiconductor industry to hold semiconductor chips in place during the dicing process. Dicing is the process of cutting a wafer of semiconductor material into individual chips. UV dicing tape is made of a thin, flexible material with a UV-curable adhesive. The tape is applied to the wafer and then exposed to UV light. The UV light cures the adhesive, which bonds the tape to the wafer. The tape helps to keep the chips in place during the dicing process and prevents them from breaking.
Base Material : PO Film, PET Film
Adhesion(gf/25mm) : 600~1200 (Before UV), 20~30 (After UV)
Grade : DU-390 Series, DU-9177 Series, DU-130P
Non UV Dicing Tape
Non-UV dicing tape is a type of tape used in the semiconductor industry to hold semiconductor chips in place during the dicing process. Dicing is the process of cutting a wafer of semiconductor material into individual chips. Non-UV dicing tape is made of a thin, flexible material with a pressure-sensitive adhesive. The tape is applied to the wafer and then pressed down firmly. The adhesive holds the chips in place during the dicing process and prevents them from breaking.
Material : PVC
Adhesion(gf/25mm) : 60~120
Grade : DN-280 Series
